In bonded or glued assemblies the shrinkage during cure can be an issue. It may result in misalignment problems or high loads and stresses in the various parts. A simple technique may be used to simulate this by modifying the material Coefficient of Thermal Expansion (CTE) and applying a global temperature load. The bonded parts should be assigned a zero value for the CTE. The glue will use some real number. The relation between the applied temperature load, glue CTE and percent shrinkage is shown as follows:
